Build volume: 192 × 108 × 190 mm

Pixel size: 100 μm

Technology: Low Force Peeling DLP Technology

Dynamic layer thickness: 0.025 - 0.3 mm

Printing speed: Up to 80 mm (3 inches) / 1 hour ( Depending on the resin type and slicer settings )
Materials:

Available materials: ShapeMaterials; Basic / Functional / Advanced Series

Material packaging: 1 kg
Hardware:

Wavelength: 405nm

Light source: LED light source, Texas Instruments DMD chip

Resolution: 1920 × 1080 pixels

Door control: Printing will be paused automatically if the cover is opened (Optional)

Building environment: Automatic heating resin tank

Air filtration: Build-in air filter in building chamber

Touchscreen: 7’’ touchscreen

Connectivity: USB2.0, Wi-Fi(2.4GHz), Ethernet

Input: 100~240 VAC，3A，50/60Hz

Rated power: 250 W
Software:

Operating system: Windows 7/8/10/11

File format(input): .stl, .obj

File format (Output): .rs, .shape

Slicing software: ShapeWare

Advanced functions: Support editing, automatic repair, model cutting, hollowing, perforating, labeling

Wireless printing: Deliver printing tasks to specified printer in LAN environment via "One Click" operation

Cluster management: Manage the printing tasks of multiple devices in LAN environment

Language: Chinese, English
Size & Weight:

Device dimension: 420 × 400 ×604 mm

Device dimension (With open cover): 600 × 400 × 800 mm

Net weight: 26 kg

Package size: 570 × 540 × 850 mm

Package weight: 40 kg